Hőlégfúvó kiforrasztó állomás.
SMD rework, SMD munkákhoz, kézi ki és beforrasztáshoz.
Hagyományos és egyszerű felépítés és állíthatóság:
Potméterrel állítható levegő, nyomógombbal állítható hőfok (le/fel)
A 858D különböző brandek ugyanazon terméke, márka pl.: QSunrun vagy Kasadi.
Supply hot air desoldering station 858D 858A adjustable temperature welding stand
Model :858 / 858d
Category: LED light emitting tube indication, microcomputer digital display Power consumption: 700W
Air pump air flow type brushless fan soft wind
Air flow :120 L / min (max)
Display form: LED light emitting tube /LED digital (resolution 1 ° C)
Handle assembly length 1 20cm (including handle wire)
Fuselage size 13.8cm (H) * 10cm (W) * 15cm (L)
Body weight :1.55kg
Noise less than :45dB
This Solder Station Especially For Lead - Free Desolder.
Sepcifition:
Mode: 858D 700w 110/ 220V BGA Soldering Station
Type:Luminous Discharge Tube Display Indication
Power Consumption:700W
Type of pump airflow: Airflow Brushless fan with soft air
Amount of Airflow :120L per minute (Max.)
Temperature Range:100-450F
Type of Display: Luminous Discharge Tube Of LED
Component Length of:120cm
Handle (Inc. handle cord)
Size: L 15CM* W 10CM * H 13.8CM
Net Weight: 1.55 Kg
Noise: Less than 45DB
Feature:
1.Closed circuit Sensor ,microcomputer zero –crossing soft touch temperature control, LED visual display ,high power,
rapid rise of temperature ,accurate and stable temperature, little influence of air outflow, and unsoldering without lead.
2.Adjustable airflow, large and soft airflow easy adjustment of temperature , suitable for multiple usages.
3.Hand handle with sensor switch ,the system will turn into the working mode while the handle is held;
and system will standby while the handle is put on holder , which is very convenient for operation.
4.Automatic cooling function of the system will prolong the life of heating element,and protect the hot air gun.
5.Brushless fan with long lifetime,low noise
Usage:
1.Apply to solder and desolder many component, for example SOIC , CHIP , OFP, PLCC,BGA etc
2.Apply to hot constriction ,drying ,divide lacquer, pre-heating , ice-out , solder pastern.